The 2nd International Conference on ALD Applications ∧ 3rd China ALD conference will be a two-day meeting, dedicated to the fundamental, materials, and applications of Atomic Layer Deposition (ALD) technology. It will be held in Shanghai, China, from October 16 to 17, 2014. Following the success of the 1st and 2nd China ALD Scientific Meeting in 2010 and 2012, the 3rd China ALD 2014 conference will feature plenary sessions, poster sessions and an industrial exhibition. Papers submitted by students will be eligible for the ¡°Best Student Paper Awards¡±.


Download the flyer URL


Download the Travel Guide URL


Download the Author Guideline URL for the submission to NRL


Poster size: 0.8m(width) x 1.2m (height)


IMPORTANT DATES

September 15, 2014¡ªAbstract Submission Ends

Please submit your abstract for Oral or Poster presentation to the Organizer via CALD[at]fudan.edu.cn.

September 20, 2014¡ªPreregistration Opens(Please contact Prof. Hongliang LU, email:CALD[at]fudan.edu.cn)

Registration on site: 15 Oct. 2014 (whole day)

Registration Fee:
Normal: RMB 2000 (US400); Student: RMB 1000 (US200).

Download Registration Form (in Chinese) URL


Sponsors